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Modelo estadístico predictivo de las propiedades mecánicas de la madera de Pinus radiata (D. Don) tratada térmicamente

Código de equipo: ING 5890

Universidad: Autónoma de Chile

Sede: Talca

País: Chile

Ciudad: Talca

Equipo: Armando Delarze, Carolina Ramirez

Profesores guía: Ricardo I Castro, Luis Soto-Cerda

In this thesis, the mechanical behavior of untreated dry wood of Pinus radiata D. Don grown in Chile, subjected to temperature stress, was studied in order to determine and predict the effect of the treatment against mechanical stresses, through studies experimental and statistical for its determination.

Most of the results describe that heat treatment at high temperatures influences the decrease in mechanical properties, altering the chemical composition, possibly due to the degradation of hemicellulose that connects cellulose and lignin structures in the wall. cell, and at low temperatures, segregating and collapsing cell walls, causing deterioration of wood. Regardless of the time the wood remains exposed.

Thanks to the analysis of a statistical model, the maximum durability of the wood and its way of using it (as pillars or as chains) were determined, analyzing the optimal factors, results that demonstrated that resistance, for flexotraction, temperatures close to 90 ° C  and its resistance is maximized at 7 days of exposure, to then have a decay over time, for compression parallel to the fiber between 100 ° C and above 18 days of exposure and at temperatures close to 85 ° C and for over 12 days of exposure for compression perpendicular to the fiber, on Pinus radiata D. Don wood.

On the other hand, this study showed that cold is the main responsible for the loss of resistance in wood due to the crystallization of water.

DOCUMENTOS ADJUNTOS


© Derechos reservados por sus autores intelectuales.

Video explicativo: https://vimeo.com/443851994
Carta del profesor: Armando Delarze_apoyo presentacion concurso Madera 21
Resumen ejecutivo: resuemn ejecutivo
Presentación: ING_PPT armando
Lámina 01: lamina 1
Lámina 02: lamina 2

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